Suffixes
SKU letters after the model number. Variants of a model share its version and differ by suffix.
75 suffixes
| Suffix | CPUs | First released | Meaning |
|---|---|---|---|
| U | 170 | 2012-Q2 | Ultra-low-power mobile (15 W class) |
| T | 151 | 2010-Q3 | Power-optimized desktop part (35 W class) |
| M | 100 | 2007-Q4 | Mobile (pre-2015 naming) |
| H | 85 | 2013-Q4 | High-performance mobile (45 W class) |
| L | 80 | 2011-Q2 | Low power (server) / low voltage |
| E | 78 | 2004-Q1 | Embedded, long-life availability |
| Y | 67 | 2013-Q1 | Extremely low-power mobile (5–7 W class) |
| K | 54 | 2004-Q4 | Unlocked multiplier for overclocking |
| F | 40 | 2014-Q1 | No integrated graphics (requires a discrete GPU) |
| TE | 39 | 2013-Q2 | Embedded, power-optimized (35 W class) |
| P | 34 | 2008-Q2 | Mobile performance thin-and-light (28 W class); on desktop Xeon W: higher power |
| S | 34 | 2009-Q1 | Low-power desktop part (65 W class, pre-2015 lineups) |
| X | 34 | 2010-Q1 | Extreme / X-series: unlocked high-end desktop |
| HQ | 33 | 2013-Q2 | High-performance mobile, quad core |
| G | 29 | 2014-Q1 | Includes discrete-class graphics (e.g. Iris Pro / Radeon) or, on Pentium/Celeron, a graphics model letter |
| N | 29 | 2007-Q4 | Network / NFV-optimized server part |
| R | 27 | 04'16 | Desktop part in a BGA package with Iris Pro graphics; on Xeon: refreshed SKU |
| HX | 26 | 2022-Q2 | Highest-performance mobile, desktop-class die |
| QM | 22 | 2009-Q3 | Mobile, quad core |
| KF | 21 | 2019-Q1 | Unlocked multiplier, no integrated graphics |
| UE | 20 | 2010-Q1 | Embedded, ultra-low power |
| NT | 17 | 2018-Q1 | Network-optimized, extended temperature |
| V | 14 | 2019-Q2 | Lunar Lake: memory on package |
| G7 | 13 | 2019-Q3 | Integrated graphics level 7, the fastest tier (Ice Lake / Tiger Lake) |
| C | 11 | 2010-Q4 | Server/embedded: communications (integrated networking features) |
| HE | 11 | 2019-Q2 | High-performance mobile, embedded |
| HL | 11 | 2019-Q2 | High-performance mobile, low power |
| J | 11 | 2004-Q2 | Pentium 4 / Celeron D with Execute Disable Bit |
| UM | 11 | 2010-Q1 | Mobile, ultra-low voltage |
| EQ | 10 | 2013-Q2 | Embedded, quad core |
| B | 9 | 2018-Q2 | BGA package (soldered) |
| D | 9 | 2013-Q2 | Dense server (Xeon D) or desktop variant |
| MQ | 8 | 2013-Q2 | Mobile, quad core |
| HK | 7 | 2015-Q3 | High-performance mobile, unlocked |
| PE | 7 | 2022-Q1 | Embedded, mobile performance |
| Yplus | 7 | 2023-Q1 | Speed Select Technology profiles (Y+) |
| A | 6 | 04'16 | Variant model |
| G4 | 6 | 2019-Q3 | Integrated graphics level 4 (Ice Lake / Tiger Lake) |
| IT | 6 | 2018-Q1 | |
| plus | 6 | 2023-Q1 | Accelerators enabled (the + suffix) |
| RK | 6 | 2015-Q1 | |
| XM | 6 | 2009-Q3 | Mobile, extreme edition (unlocked) |
| QE | 5 | 2011-Q1 | Embedded, quad core |
| RE | 5 | 2021-Q1 | Embedded, extended temperature / real-time |
| UL | 5 | 2022-Q3 | |
| KS | 4 | 2019-Q4 | Special edition: unlocked, binned for the highest clocks |
| ME | 4 | 2012-Q2 | Embedded, mobile |
| NTE | 4 | 2022-Q1 | |
| NX | 4 | 2022-Q3 | |
| W | 4 | 2012-Q1 | |
| EC | 3 | 2014-Q1 | |
| GRE | 3 | 2020-Q3 | Embedded, graphics, real-time and extended temperature |
| LE | 3 | 2010-Q1 | Embedded, low power |
| LM | 3 | 2010-Q1 | Mobile, low voltage |
| MLE | 3 | 2021-Q3 | |
| MRE | 3 | 2021-Q3 | |
| Q | 3 | 2021-Q2 | Liquid-cooled server part |
| TER | 3 | 2022-Q1 | |
| XE | 3 | 2017-Q3 | Extreme Edition: unlocked high-end desktop flagship |
| CT | 2 | 2010-Q4 | |
| FE | 2 | 2021-Q1 | |
| G1 | 2 | 2019-Q3 | Integrated graphics level 1 (Ice Lake) |
| G7E | 2 | 2020-Q3 | Embedded variant of a G7 part |
| GE | 2 | 2019-Q2 | |
| HF | 2 | 2019-Q2 | High-performance mobile, no integrated graphics |
| I | 2 | 2018-Q1 | |
| ML | 2 | 2019-Q2 | |
| MX | 2 | 2013-Q2 | Mobile, extreme edition |
| PT | 2 | 2008-Q2 | |
| TR | 2 | 2022-Q1 | |
| G4E | 1 | 2020-Q3 | Embedded variant of a G4 part |
| GEL | 1 | 2019-Q2 | |
| NE | 1 | 2022-Q1 | |
| Ya | 1 | 2014-Q3 | |
| Yc | 1 | 2014-Q4 |